personnel profile

Research Statement

The Goodson group studies thermal transport phenomena with very small length and time scales. Applications include nanoscale semiconductor devices, phase change memory, energy conversion devices such as solar/photovoltaics and thermoelectrics, and two-phase microfluidic heat sink technology. Professor Goodson is a co-founder and former CTO of Cooligy, a startup developing heat sinks for electronic systems. Goodson is an Associate Editor for the ASME Journal of Heat Transfer and is Editor-in-Chief of Nanoscale and Microscale Thermophysical Engineering.

Research Projects
“Nanostructured Materials/Interfaces for Thermoelectric Energy Recovery,” Precourt Institute
“Nanostructured Interfaces for Thermoelectric Energy Recovery,” Bosch
“Nanostructured Interfaces for Robust, High-Power Electronic Systems and Thermoelectric Modules,”...
Summary: [Close Box] Summary: [Close Box] Summary: “Nanostructured Materials/Interfaces for Thermoelectric Energy Recovery,” Precourt Institute [Close Box] Summary: “Nanostructured Interfaces for Thermoelectric Energy Recovery,” Bosch [Close Box] Summary: “Nanostructured Interfaces for Robust, High-Power Electronic Systems and Thermoelectric Modules,”..... [Close Box] Summary: “Thermal Engineering of Phase Change Memory (PCRAM),” Intel [Close Box] Summary: “Compact Thermal Simulations of Phase Change Memory Devices,” Ovonyx [Close Box] Summary: “Picosecond Thermal Gratings for IC Films and Interfaces,” Intel/Semiconductor Research Corporation [Close Box] Summary: “Nanoscale Thermal Metrology for Advanced Packaging and Interfaces,” Semiconductor Research Corporation [Close Box] Summary: “Stable Two-Phase Convection in Microchannel Heat Sinks,” AMD/Semiconductor Research Corporation [Close Box] Summary: “Advanced Thermal Interface Materials,” Lockheed Martin [Close Box] Summary: “Vapor-Venting Two-Phase Microfluidic Heat Exchangers,” MARCO/DARPA Interconnect Focus Center [Close Box] Summary: “Nanostructured Wicks for Cooling of Automotive Electronics,” Toyota R&D [Close Box] Summary: “Thermal Phenomena in Novel Materials,” Applied Materials [Close Box] Summary: “Two-Phase Microfluidic Cooling Technology Assessments,” Pipeline Microsystems [Close Box] Summary: [Close Box]
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Degree	Discipline	Year	School
PhD	Mechanical Engineering	1993	MIT
MS	Mechanical Engineering	1991	MIT
BS	Humanities	1989	MIT
BS	Mechanical Engineering	1989	MIT

Publication Title	Author(s)/Speaker(s)	Open Document
The impact of thermal boundary resistance in phase-change memory devices	Reifenberg, Kencke, and Goodson	A104_1515.pdf
Thermal Resistance between low-dimensional nanostructures and semi-infinite media	Panzer and Goodson	A100_1516.pdf
Ordering up the minimum thermal conductivity of solids	Goodson	A99_1514.pdf
Heat generation and transport in nanometer scale transistors	Pop, Sinha, and Goodson	A94_1517.pdf
Integrated microchannel cooling for three-dimensional circuit architectures	Koo, Im, Jiang, and Goodson	A82_1518.pdf
Title: The impact of thermal boundary resistance in phase-change memory devices Author(s): Reifenberg, Kencke, and Goodson Journal: IEEE Electron Device Letters , Volume 29 Date Published: 2008 [Close Box] Title: Thermal Resistance between low-dimensional nanostructures and semi-infinite media Author(s): Panzer and Goodson Journal: Journal of Applied Physics , Volume 103 Date Published: 2008 [Close Box] Title: Ordering up the minimum thermal conductivity of solids Author(s): Goodson Journal: Science , Volume 315 Date Published: 2007 [Close Box] Title: Heat generation and transport in nanometer scale transistors Author(s): Pop, Sinha, and Goodson Journal: Proceedings of the IEEE , Volume 94 Date Published: 2006 [Close Box] Title: Integrated microchannel cooling for three-dimensional circuit architectures Author(s): Koo, Im, Jiang, and Goodson Journal: ASME Journal of Heat Transfer , Volume 127 Date Published: 2005 [Close Box]
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Academic Honors & Awards

Keynote Lecture, SEMITHERM 2007. Keynote Lecture, THERMINIC 2005. Keynote Lecture, ITHERM 2004. Keynote Lecture, INTERPACK 2003. Best Paper Award, SEMITHERM 2001. Outstanding Reviewer, ASME Journal of Heat Transfer. NSF CAREER Award. ONR Young Investigator Award. JSPS Visiting Professor, Tokyo Institute of Technology.